发明名称 |
HEAT RADIATING SUBSTRATE USING ELECTRODEPOSITION COATING, AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an heat radiating substrate and a method for manufacturing the same. <P>SOLUTION: The method for manufacturing the heat radiating substrate using electrodeposition coating includes: a step S310 of preparing a metal core; a step S320 of anodizing the metal core to form a first insulating layer thereon; a step S330 of forming a hole in the metal core formed with the first insulating layer thereon; a step S340 of applying an electrodeposition coating to the metal core formed with the hole therein to form a second insulating layer at the surface of the first insulating layer and an inner surface of the hole; and a step S350 of forming a circuit layer on the second insulating layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013127122(A) |
申请公布日期 |
2013.06.27 |
申请号 |
JP20130025266 |
申请日期 |
2013.02.13 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
SHIN SANGHYUN;LEE YOUNGKI;HEO CHEOL HO |
分类号 |
C23C28/00;C25D11/04;C25D11/26;C25D11/30;C25D13/00;H05K3/44 |
主分类号 |
C23C28/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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