| 摘要 |
PURPOSE: A semiconductor device is provided to minimize a moisture absorption fault by mounting a semiconductor chip in a position far from a die pad. CONSTITUTION: A die pad(8d) has an upper side(8da) and a lower side(8db). Multiple leads(8a) are arranged around the die pad. A first semiconductor chip(1) has a surface side(1a) and a reverse side(1b). A second semiconductor chip(2) has a surface side(2a) and a reverse side. A first conductive member(5a) electrically connects a first electrode pad to a lead. [Reference numerals] (1,2) Semiconductor chip; (1a,2a) Surface side; (1b,2b) Reverse side; (4) Sealing body; (4b,8db) Lower side; (5a) Wire(conductive member); (6) QFP(semiconductor device); (8a) Lead; (8d) Die pad; (8da) Upper side; (8f) Bar lead |
