发明名称 |
CMP SLURRY RECYCLING SYSTEM AND METHODS |
摘要 |
<p>The present invention provides a system and method for recycling an abrasive chemical mechanical polishing (CMP) slurry after polishing substrates therewith. The method comprises circulating the recovered CMP slurry from a blending tank through an ultrafiltration unit and back into the, the ultrafiltration unit removing a predetermined amount of water from recovered slurry to form a slurry concentrate; optionally adjusting the pH of the concentrate to a predetermined target level; and optionally adding selected additive chemical components and/or water to the concentrate in amounts sufficient to form a reconstituted CMP slurry that is suitable for use in a CMP process.</p> |
申请公布号 |
EP2606508(A2) |
申请公布日期 |
2013.06.26 |
申请号 |
EP20110818710 |
申请日期 |
2011.08.17 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
AMOROSO, NICHOLAS;TOLLA, BRUNO;BOLDRIDGE, DAVID |
分类号 |
H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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