| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve performance, reduce a cost, and improve a yield, as to a semiconductor device having an MCP (multiple chip package) structure for disposing a plurality of semiconductor chips in the same package, its method for manufacturing, and a semiconductor substrate. <P>SOLUTION: This semiconductor substrate is equipped with a first functional chip 30A functioning as a semiconductor chip, a second functional chip 31A disposed adjacent to the first functional chip 30A while functioning as a semiconductor chip, and scribe lines 21 (21A, 21B) demarcating the first functional chip 30A and the second functional chip 31A respectively. The first functional chip 30A and the second functional chip 31A are dispose so that cutting of a single first functional chip 30A only, cutting of a single second functional chip 31A only, or cutting in a combined region of the first functional chip 30A and the second functional chip 31A becomes possible by selecting the scribe lines 21A, 21B for cutting treatment. <P>COPYRIGHT: (C)2010,JPO&INPIT |
