发明名称 WAFER PROCESSING APPARATUS
摘要 PURPOSE: A wafer processing device is provided to reduce the volume of the wafer processing device in the plane by installing a support unit supporting an FOUP(Front Opening Unified Pod) on the lower side of a stage. CONSTITUTION: A stage(120) is combined with the front part of a frame(110) at the lower side of an opening part(112). The stage mounts an FOUP(50) on the upper surface thereof. A door(130) is slidably installed in the left and right lateral direction of the frame. The door is detachably combined with a cover(51) of the FOUP supported by the stage. A control part(160) controls matters required for wafer processing.
申请公布号 KR20130068831(A) 申请公布日期 2013.06.26
申请号 KR20110136230 申请日期 2011.12.16
申请人 TERASEMICON CORPORATION 发明人 YOO, HAN KIL;YU, SEUNG SYUL
分类号 H01L21/67;H01L21/02;H01L21/683 主分类号 H01L21/67
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