发明名称 CMP PAD CONDITIONER AND METHOD OF MANUFACTURING THE SAME
摘要 PURPOSE: A CMP(Chemical Mechanical Polishing) pad conditioner and a manufacturing method thereof are provided to basically prevent a substrate from being bent and diamond of the conditioner from being separated by forming the CMP pad conditioner using a selective deposition method. CONSTITUTION: A diamond thin film(12) is formed on a substrate(11). A mask(30) having an opening part(35) in a matrix type is placed on the diamond thin film. The mask is made of one selected from molybdenum, tungsten and graphite. A protrusion part(15) comprising diamond(40) is formed on the diamond thin film. The mask is removed.
申请公布号 KR20130068820(A) 申请公布日期 2013.06.26
申请号 KR20110136213 申请日期 2011.12.16
申请人 KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY 发明人 BAIK, YOUNG JOON;PARK, JONG KEUK;LEE, WOOK SEONG
分类号 H01L21/304 主分类号 H01L21/304
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