发明名称 |
METHOD FOR PREPARING TIN-BASED SOLDER PASTE USING A SYNTHESIS PROCESS BY CHEMICAL REDUCTION |
摘要 |
PURPOSE: A method for manufacturing a tin-based solder paste using a chemical synthesis process by reduction is provided to manufacture the solder paste using a cheap tin precursor. CONSTITUTION: A method for manufacturing a tin-based solder paste using a chemical synthesis process by reduction is as follows: a step of melting a reducing agent and a surface stabilizing agent in a solvent(S110); a step of injecting a tin-containing liquid precursor to the reducing agent solution(S120); a step of reducing and cooling the reducing agent solution in which the liquid precursor is injected to synthesize minute particles of tin(S130); a step for collecting the tin-based minute particles by removing upper solution from the solution containing the tin-based minute particles(S140); and a step for manufacturing the paste by mixing the tin-based minute particles and flux(S150). [Reference numerals] (AA) Start; (BB) End; (S110) Step of dissolving a reducing agent and a surface stabilizing agent in a solvent; (S120) Step of injecting a tin-containing liquid precursor in the reducing agent solution; (S130) Step of forming minute tin particles; (S140) Step of collecting the minute tin particles; (S150) Step of mixing the minute tin particles with flux to manufacture paste |
申请公布号 |
KR101279459(B1) |
申请公布日期 |
2013.06.26 |
申请号 |
KR20120041162 |
申请日期 |
2012.04.19 |
申请人 |
SEOUL NATIONAL UNIVERSITY OF TECHNOLOGY CENTER FOR INDUSTRY COLLABORATION |
发明人 |
LEE, JONG HYUN;CHEE, SANG SOO |
分类号 |
B23K35/22;B22F9/24;B23K35/36 |
主分类号 |
B23K35/22 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|