发明名称 METHOD FOR PREPARING TIN-BASED SOLDER PASTE USING A SYNTHESIS PROCESS BY CHEMICAL REDUCTION
摘要 PURPOSE: A method for manufacturing a tin-based solder paste using a chemical synthesis process by reduction is provided to manufacture the solder paste using a cheap tin precursor. CONSTITUTION: A method for manufacturing a tin-based solder paste using a chemical synthesis process by reduction is as follows: a step of melting a reducing agent and a surface stabilizing agent in a solvent(S110); a step of injecting a tin-containing liquid precursor to the reducing agent solution(S120); a step of reducing and cooling the reducing agent solution in which the liquid precursor is injected to synthesize minute particles of tin(S130); a step for collecting the tin-based minute particles by removing upper solution from the solution containing the tin-based minute particles(S140); and a step for manufacturing the paste by mixing the tin-based minute particles and flux(S150). [Reference numerals] (AA) Start; (BB) End; (S110) Step of dissolving a reducing agent and a surface stabilizing agent in a solvent; (S120) Step of injecting a tin-containing liquid precursor in the reducing agent solution; (S130) Step of forming minute tin particles; (S140) Step of collecting the minute tin particles; (S150) Step of mixing the minute tin particles with flux to manufacture paste
申请公布号 KR101279459(B1) 申请公布日期 2013.06.26
申请号 KR20120041162 申请日期 2012.04.19
申请人 SEOUL NATIONAL UNIVERSITY OF TECHNOLOGY CENTER FOR INDUSTRY COLLABORATION 发明人 LEE, JONG HYUN;CHEE, SANG SOO
分类号 B23K35/22;B22F9/24;B23K35/36 主分类号 B23K35/22
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