发明名称 LIGHT EMITTING PACKAGE
摘要 PURPOSE: A light emitting device package is provided to obtain the same effect as an LED by applying a dummy package when the number of LEDs arranged in series is not equal. CONSTITUTION: A light emitting device(450) is mounted on a circuit substrate(410). The circuit substrate includes a circuit pattern(411,412) to supply external power to the light emitting device. A lens part(480) is formed on the light emitting device and protects the light emitting device from the outside. A first metal wiring layer(431) and a second metal wiring layer(432) are bonded to the circuit substrate by a metal bonding layer(420). A thin film substrate(440) is mounted on the first metal wiring layer and the second metal wiring layer.
申请公布号 KR20130068957(A) 申请公布日期 2013.06.26
申请号 KR20110136441 申请日期 2011.12.16
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 NAM, KYUNG PIL;LEE, SEUNG WOO
分类号 H01L33/48 主分类号 H01L33/48
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