发明名称 Integrated circuits formed on strained substrates and including relaxed buffer layers and methods for the manufacture thereof
摘要 Embodiments of a method for producing an integrated circuit are provided, as are embodiments of an integrated circuit. In one embodiment, the method includes providing a strained substrate having an n-active region and a p-active region, etching a cavity into one of the n-active region and the p-active region, embedding a relaxed buffer layer within the cavity, forming a body of strain material over the relaxed buffer layer having a strain orientation opposite that of the strained substrate, and fabricating n-type and t-type transistors over the n-active and p-active regions, respectively. The channel of the n-type transistor extends within one of the strained substrate and the body of strain material, while the channel of the p-type transistor extends within the other of the strained substrate and the body of strain material.
申请公布号 US8471342(B1) 申请公布日期 2013.06.25
申请号 US201113315939 申请日期 2011.12.09
申请人 FLACHOWSKY STEFAN;HOENTSCHEL JAN;GLOBALFOUNDRIES, INC. 发明人 FLACHOWSKY STEFAN;HOENTSCHEL JAN
分类号 H01L21/70 主分类号 H01L21/70
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