发明名称 HEAT AGING-RESISTANT POLYAMIDES
摘要 Thermoplastic molding compositions comprising A) from 10 to 99% by weight of at least one thermoplastic polyamide, B) from 0.1 to 5% by weight of at least one polyethyleneimine homo- or copolymer, C) from 0.05 to 3% by weight of a lubricant, D) from 0.05 to 3% by weight of a copper-containing stabilizer or of a sterically hindered phenol or mixtures thereof, E) from 0 to 60% by weight of further additives, the sum of the percentages by weight of components A) to E) adding up to 100%.
申请公布号 KR101278734(B1) 申请公布日期 2013.06.25
申请号 KR20077020471 申请日期 2006.02.08
申请人 发明人
分类号 C08K3/16;C08K5/098;C08K5/20;C08L79/02 主分类号 C08K3/16
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