发明名称 Sputtering apparatus and driving method thereof
摘要 A sputtering apparatus for depositing a target material on a substrate includes a chamber, a target in the chamber to provide the target material, a carrier to carry the substrate in the chamber to face the target, and a plurality of masks arranged along sides of the carrier and being movable back and forth with respect to the carrier.
申请公布号 US8470142(B2) 申请公布日期 2013.06.25
申请号 US20060451440 申请日期 2006.06.13
申请人 KIM SUNG EUN;LIM TAE HYUN;YOO HWAN KYU;YOO KWANG JONG;MOON YANG SIK;AN BYEONG CHEOL;LG DISPLAY CO., LTD.;AVACO CO., LTD.;LG ELECTRONICS, INC. 发明人 KIM SUNG EUN;LIM TAE HYUN;YOO HWAN KYU;YOO KWANG JONG;MOON YANG SIK;AN BYEONG CHEOL
分类号 C23C14/34 主分类号 C23C14/34
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