| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package substrate which can correspond to a bump pitch of high density, and its manufacturing method. SOLUTION: A semiconductor package substrate comprises a base substrate including a circuit having a connection pad 103 in an insulation layer 101, a protection layer 106 formed on the base substrate and including polyimide with an open part for exposing the connection pad 103, and a post bump 115 including a seed layer 110 and an electrolytic plating layer 114 formed on the connection pad at the open part of the protection layer 106. COPYRIGHT: (C)2012,JPO&INPIT |
