| 摘要 |
<P>PROBLEM TO BE SOLVED: To bond a cover member to a solid state image sensor with high airtightness to secure optical characteristics of a light-receiving part of the solid state image sensor and prevent occurence of noise on an image signal due to stress or a thermal load when bonding the cover member and the solid state image sensor. <P>SOLUTION: A solid state imaging device 1 includes: a solid state image sensor 2 having a light-receiving part 5 on a surface, and having a plurality of terminals 6 formed on a wiring pattern 12 provided outside the light-receiving part 5 on the surface and connected electrically to the light-receiving part 5; a cover member 3 having light transmissivity, provided on the solid state image sensor 2 so as to cover the light-receiving part 5 of the solid state image sensor 2 and provided with a plurality of through holes 3a at positions facing the terminals 6 of the solid state image sensor 2 along a direction orthogonal to the surface of the light-receiving part 5; and a bonding portion 4 provided on the surface of the solid state image sensor 2 where the light-receiving part 5, the plurality of terminals 6, and the wiring pattern 12 do not exist, for bonding the solid state image sensor 2 and the cover member 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
