| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermally-conductive pressure-sensitive adhesive composition and a thermally-conductive pressure-sensitive adhesive sheet-like molding which satisfy strength and adhesive force in a high level, methods for producing them, and an electronic device provided with the thermally-conductive pressure-sensitive adhesive composition or thermally-conductive pressure-sensitive adhesive sheet-like molding. <P>SOLUTION: The thermally-conductive pressure-sensitive adhesive composition is obtained by performing, in a mixed composition including: 100 pts.mass of a (meth)acrylic resin composition (A) including a (meth)acrylic ester polymer (A1), a (meth)acrylic ester monomer (α1) and a polyfunctional monomer (D) having a plurality of polymerizable unsaturated bonds; 2 pts.mass or more and 13 prts. mass or less of a dispersant (C); 0.1 pt.mass or more and 4 pts.mass or less of a PAN-based carbon fiber (H); and 50 pts.mass or more and 500 pts.mass or less of a thermally-conductive filler (B) other than the PAN-based carbon fiber (H), the dispersant (C) being a fatty acid ester of a polyhydric alcohol polymer, polymerization reaction of the (meth)acrylic ester monomer (α1) and the polyfunctional monomer (D), and crosslinking reaction of the (meth)acrylic ester polymer (A1) and/or a polymer including a structural unit derived from the (meth)acrylic ester monomer (α1). <P>COPYRIGHT: (C)2013,JPO&INPIT |
