| 摘要 |
<p>PURPOSE: A semiconductor stack package, a manufacturing method thereof, and an electronic system including the same are provided to facilitate lamination by packaging a plurality of semiconductor chips into one package. CONSTITUTION: A laminate(400) of first semiconductor chips is laminated on the upper side of an interposer. A second semiconductor chip(600) is laminated on the lower side of the interposer. An external connection electrode(650) is attached to the second semiconductor chip. A first through electrode passes through the interposer. A second through electrode is connected to the first through electrode. [Reference numerals] (AA) Separation</p> |
