发明名称 PB-FREE SOLDER ALLOY HAVING EXCELLENT PLASTIC DEFORMATION PROPERTY
摘要 <P>PROBLEM TO BE SOLVED: To provide a Pb-free solder alloy for a high temperature, mainly consisting of Zn, having a melting point of about 300-400&deg;C, having excellent wettability and reliability, and particularly having excellent workability and stress relaxation properties. <P>SOLUTION: This Pb-free solder alloy having an elongation percentage of 50% or above and tensile strength of 70 MPa or above contains 1.0-15.0 mass%, preferably 2.0-9.0 mass% of Al, and contains at least one of Ge, Cu, Ag, Ni, and P as the need arises, and the residue consists of Zn except an inevitably contained element. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013123741(A) 申请公布日期 2013.06.24
申请号 JP20110274443 申请日期 2011.12.15
申请人 SUMITOMO METAL MINING CO LTD 发明人 IZEKI TAKASHI;TAKAMORI MASAHITO
分类号 B23K35/28;C22C18/04 主分类号 B23K35/28
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