发明名称 |
ELEKTRISKE FORBINDELSER I SUBSTRATER |
摘要 |
A method of making an electrical connection between a first (top) and a second (bottom) surface of a conducting or semi-conducting substrate includes creating a trench in the first surface, and establishing an insulating enclosure entirely separating a portion of the substrate, defined by the trench. Also described is a product usable as a starting substrate for the manufacture of micro-electronic and/or micro-mechanic devices, including a flat substrate of a semi-conducting or conducting material, and having a first and a second surface and at least one electrically conducting member extending through the substrate. The electrically conducting member is insulated from surrounding material of the flat substrate by a finite layer of an insulating material, and includes the same material as the substrate, i.e. it is made from the wafer material. |
申请公布号 |
DK1609180(T3) |
申请公布日期 |
2013.06.24 |
申请号 |
DK20040722492T |
申请日期 |
2004.03.22 |
申请人 |
SILEX MICROSYSTEMS AB |
发明人 |
KAELVESTEN, EDVARD;EBEFORS, THORBJOERN;RANGSTEN, PELLE;HUHTAOJA, TOMMY;SVEDIN, NIKLAS |
分类号 |
B81B7/00;H01L21/768;H01L23/48 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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