发明名称 INFRARED IMAGING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To direct the heat generated in a signal processing circuit toward another place without directing it toward an infrared ray detection sensor. <P>SOLUTION: An infrared imaging device comprises: an infrared detection chip on which a plurality of infrared detection elements are formed; a pixel bump per infrared detection element formed on the infrared detection chip; a common bias bump; a signal processing chip including a signal processing circuit which processes a plurality of pixel signals to generate an infrared image; an input signal bump formed on the signal processing chip and disposed facing the pixel bump; a common bias supply bump disposed facing the common bias bump; a vacuum container supporting the signal processing chip and including the cooling head to be cooled; a refrigerating machine which cools the cooling head; and a metal structure which is formed on the signal processing chip, is electrically separated from the signal processing circuit, and conducts the heat generated in the signal processing circuit to the cooling head. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013126000(A) 申请公布日期 2013.06.24
申请号 JP20110272201 申请日期 2011.12.13
申请人 FUJITSU LTD 发明人 MIYATAKE TETSUYA
分类号 H04N5/33;G01J1/02;H01L23/34;H01L27/144;H01L27/146;H04N5/335 主分类号 H04N5/33
代理机构 代理人
主权项
地址