SEMICONDUCTOR INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit provided with a function of electrically specifying defective points, such as cracks of an LSI chip and peeling of resin.

SOLUTION: First to fourth outer circumferential wires 4-1 to 4-4 each having a first end and a second end, are arranged to an outer circumferential part of a semiconductor substrate 1 in an L-shape so as to respectively correspond to four corners K1-K4 of the semiconductor substrate 1. The first ends of the first to fourth outer circumferential wires 4-1 to 4-4 are connected to a power supply wire 3. Respective first to fourth detection circuits 10-1 to 10-4 detect disconnection in the first to fourth outer circumferential wires 4-1 to 4-4 respectively depending on voltages at the second ends of the first to fourth outer circumferential wires 4-1 to 4-4, and output first to fourth detection signals Amp_out1 to Amp_out4 to output pads P1 to P4.

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