Coating a substrate, comprises arranging substrate to be coated over cutting surface of target, atomizing coating material by sputtering under e.g. inert gas, and modifying distribution of target components by high energy pulsed magnetron

摘要

Coating a substrate, comprises arranging a substrate to be coated over a cutting surface (2) of a target (1), atomizing the coating material by sputtering under an inert or reactive gas containing process gas and depositing on the substrate, where the coating is carried out using a mixed target having at least one first target component and a second target component and the beginning of the sputtering method is performed by modifying the distribution of target components in a superficial target layer (3) of the cutting surface by high energy pulsed magnetron. Coating a substrate, comprises arranging a substrate to be coated over a cutting surface (2) of a target (1), atomizing the coating material by sputtering under an inert or reactive gas containing process gas and depositing on the substrate, where the coating is carried out using a mixed target having at least one first target component and a second target component and the beginning of the sputtering method is performed by modifying the distribution of target components in a superficial target layer (3) of the cutting surface by high energy pulsed magnetron, preferably high power impulse magnetron sputtering (HiPIMS).