ADHESIVE AGENT, AND METHOD FOR CONNECTING ELECTRONIC COMPONENT

摘要

Provided are: an adhesive agent which can achieve good electric conduction in a substrate that has been treated with an organic solderability preservative; and a method for connecting an electronic component. An adhesive agent comprising a (meth)acrylate having an epoxy group per molecule and a radical polymerization initiator having a one-minute half-life temperature of 110°C or higher is used. An imidazole component in an organic solderability preservative, which binds to the epoxy group in the epoxy-group-containing acrylate, is removed from the surfaces of terminals in such a manner that the imidazole component is withdrawn by the flow of an excess portion of the adhesive agent component between the terminals.