| 摘要 |
A method and system for decapsulating a portion of an encapsulated integrated circuit delivers etchant mixture in variable but precise, high-velocity micro-metered pulses to a single outlet port of a pump from any one of or a combination of separate inlet ports connected to separate etchant source containers holding specific etchant solutions, controls temperature of the etchant mixture by passing the etchant mixture from the outlet port through a serpentine passage in a temperature-controlled metal block, and delivers the etchant mixture from the serpentine passage of the temperature-controlled block via a delivery conduit to an encapsulation surface of the encapsulated integrated circuit.
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