发明名称 |
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF |
摘要 |
A semiconductor package is presented which has a suitable structure for effectively shielding electromagnetic wave interference (EMI) in a cavity area to which a semiconductor chip is attached. The semiconductor package is assembled such that a lower substrate to which the semiconductor chip is attached is adhered to an EMI shielding & electric I/O body having various types of EMI shielding & electric I/O metal patterns by soldering. Further, the EMI shielding & electric I/O body is adhered to an upper substrate by soldering thereby simplifying assembling of the semiconductor package.
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申请公布号 |
US2013154066(A1) |
申请公布日期 |
2013.06.20 |
申请号 |
US201313739565 |
申请日期 |
2013.01.11 |
申请人 |
AMKOR TECHNOLOGY, INC.;AMKOR TECHNOLOGY, INC. |
发明人 |
KIM DONG IN;LEE JAE UNG;CHO EUNNARA;KIM MIN JU |
分类号 |
H01L23/552 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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