发明名称 |
HEAT DISSIPATING FIN, HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A heat dissipating device includes a base and a plurality of heat dissipating fins. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.
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申请公布号 |
US2013153189(A1) |
申请公布日期 |
2013.06.20 |
申请号 |
US201113329313 |
申请日期 |
2011.12.18 |
申请人 |
LIN CHIA-YU;TSAI YEN |
发明人 |
LIN CHIA-YU;TSAI YEN |
分类号 |
F28F7/00;B21D53/02;B22D19/00 |
主分类号 |
F28F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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