BALL GRID ARRAY PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

Disclosed herein is a ball grid array (BGA) package including: a printed circuit board (PCB) in which a device is mounted via solder balls, wherein the PCB includes a plurality of pad patterns each including the solder balls and having the same shape. A uniform amount of solder balls is included in the pad patterns having the same shape, and thus the BGA package according to the present invention can prevent a short or open from occurring due to a conventional problem of an excessive or small amount of solder balls.