发明名称 |
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED WITH THE SAME |
摘要 |
An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated with the composition, the composition including an epoxy resin; an inorganic filler; a curing accelerator; and a curing agent, the curing agent including a compound having a multifunctional novolac structure including at least one biphenyl moiety, the compound being represented by Formula 1: wherein n is about 1 to about 10.
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申请公布号 |
US2013158165(A1) |
申请公布日期 |
2013.06.20 |
申请号 |
US201213719875 |
申请日期 |
2012.12.19 |
申请人 |
HAN SEUNG;KIM JU MI;PARK SUNG SU;LEE EUN JUNG |
发明人 |
HAN SEUNG;KIM JU MI;PARK SUNG SU;LEE EUN JUNG |
分类号 |
C09D163/00 |
主分类号 |
C09D163/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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