| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal base which can suppress thermal expansion and thermal contraction due to heat generated by a device, and also provide a method of manufacturing the same and a device package based on the same. SOLUTION: A metal base 110 where at least one device 10 is mounted comprises: a first base member 111, on one face of which a mounting part for mounting the device 10 is formed; and a second base member 112 which has a thermal expansion coefficient smaller than the first base member 111 and is adhered onto the other face of the first base member 111 to restrict thermal contraction and thermal expansion of the first base member 111. COPYRIGHT: (C)2013,JPO&INPIT |
