发明名称 CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To suppress an occurrence of acoustic noise without causing a steep rise of manufacturing cost and deterioration in degree of layout freedom. <P>SOLUTION: A wiring board comprises: a multilayer ceramic capacitor including an element assembly in which a plurality of dielectric layers and a plurality of internal electrodes are alternately laminated one by one, and a pair of external electrodes provided on both ends of the element assembly and to which the internal electrodes are connected; a wiring board including an insulating substrate and a pair of lands formed on the insulating substrate by a copper foil and to which the pair of external electrodes of the multilayer ceramic capacitor are connected, respectively; and a contact suppression part provided on the wiring board between the pair of lands for suppressing contact of the wiring board with the element assembly of the multilayer ceramic capacitor. As a result, the contact suppression part forms a clearance between the element assembly of the multilayer ceramic capacitor and the wiring board thereby to make it possible to suppress an occurrence of acoustic noise without causing a steep rise of manufacturing cost and deterioration in degree of layout freedom. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013122939(A) 申请公布日期 2013.06.20
申请号 JP20110269809 申请日期 2011.12.09
申请人 SONY CORP 发明人 TAKEDA YUKIHIRO;MAEDA ATSUSHI
分类号 H05K3/34 主分类号 H05K3/34
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