INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ASSISTANCE MOLD AND METHOD OF MANUFACTURE THEREOF

摘要

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate, the integrated circuit having an inactive side and a non-horizontal side; mounting a mold chase having a buffer layer over the integrated circuit; forming an encapsulation between the substrate and the buffer; and removing the mold chase, leaving the encapsulation having a recess exposing a portion of the non-horizontal side.