发明名称 |
RESIN COMPOSITION, CURED RESIN PRODUCT, WIRING BOARD, AND MANUFACTURING METHOD FOR WIRING BOARD |
摘要 |
By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed. |
申请公布号 |
EP2604639(A2) |
申请公布日期 |
2013.06.19 |
申请号 |
EP20110816378 |
申请日期 |
2011.08.05 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
MORITA, MASAKI;NAKAMURA, KONATSU;TAKANEZAWA, SHIN |
分类号 |
C08G59/42;C08G59/22;C08G59/68;C08L63/00;H05K3/18;H05K3/38;H05K3/46 |
主分类号 |
C08G59/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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