| 摘要 |
The semiconductor device includes a support substrate 101 on which a semiconductor element 105 to be mounted, a covering member 102 disposed to the support substrate via a bonding member, and a space 107 is defined between the covering member 102 and the support substrate 101. The support substrate 101 has a protruded portion 103 and the covering member 102 is disposed so that a portion thereof is in contact with the protruded portion 103 so as to define an air vent leading from the space 107 to outside. |
