发明名称 |
POLISHING PAD CONDITIONING |
摘要 |
<p>An apparatus for conditioning a polishing pad of a CMP apparatus for making semiconductor wafers is provided which includes a control arm configured to extend at least partially over a polishing pad. The apparatus also includes at least one cylindrical conditioning piece coupled to the control arm where the control arm is configured to apply the at least one cylindrical conditioning piece to the polishing pad.</p> |
申请公布号 |
EP1583638(B1) |
申请公布日期 |
2013.06.19 |
申请号 |
EP20040700206 |
申请日期 |
2004.01.05 |
申请人 |
INTEL CORPORATION |
发明人 |
GOLZARIAN, REZA, M.;MOINPOUR, MANSOUR |
分类号 |
B24B37/04;B24B53/007;B24B53/017;B24B53/12 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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