发明名称 |
SHUNTING LAYER ARRANGEMENT FOR LEDS |
摘要 |
A shunting pattern on a surface of an LED die comprises an array of metal dots having widths that are on the order of 2Lt-5Lt (where Lt is transfer length) so as not to block a significant amount of light, yet have low contact resistance to the semiconductor current spreading layer. Contact resistance is not significantly reduced with widths greater than 2Lt. Each dot represents a current injection area. For a minimum 2Lt width and 50 square dots per mm2, the top surface area of an LED die will have about 1% of its surface covered by the dots. To cause the current to be evenly distributed over the top surface of the LED, the dots are connected with a grid of very thin metal connectors, having widths much less than 2Lt. In one embodiment, a wire bond electrode is formed near the middle of the top surface of the LED to create a more uniform current distribution. |
申请公布号 |
EP2603936(A1) |
申请公布日期 |
2013.06.19 |
申请号 |
EP20110754489 |
申请日期 |
2011.07.25 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V.;PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH |
发明人 |
LOPEZ, TONI;ALDAZ, RAFAEL, IGNACIO |
分类号 |
H01L33/38;H01L33/40 |
主分类号 |
H01L33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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