发明名称 |
Epoxy resin composition for optical semiconductor device, lead frame obtained using the same for optical semiconductor device, and optical semiconductor device |
摘要 |
The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (D): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; and (D) at least one antioxidant selected from the group consisting of hindered-phenol antioxidants, sulfide antioxidants and hindered-amine antioxidants.
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申请公布号 |
US8466483(B2) |
申请公布日期 |
2013.06.18 |
申请号 |
US201113243397 |
申请日期 |
2011.09.23 |
申请人 |
OHNISHI HIDENORI;NAKAMURA KOHEI;FUKE KAZUHIRO;OTA SHINYA;NITTO DENKO CORPORATION |
发明人 |
OHNISHI HIDENORI;NAKAMURA KOHEI;FUKE KAZUHIRO;OTA SHINYA |
分类号 |
H01L29/22 |
主分类号 |
H01L29/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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