发明名称 Epoxy resin composition for optical semiconductor device, lead frame obtained using the same for optical semiconductor device, and optical semiconductor device
摘要 The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (D): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; and (D) at least one antioxidant selected from the group consisting of hindered-phenol antioxidants, sulfide antioxidants and hindered-amine antioxidants.
申请公布号 US8466483(B2) 申请公布日期 2013.06.18
申请号 US201113243397 申请日期 2011.09.23
申请人 OHNISHI HIDENORI;NAKAMURA KOHEI;FUKE KAZUHIRO;OTA SHINYA;NITTO DENKO CORPORATION 发明人 OHNISHI HIDENORI;NAKAMURA KOHEI;FUKE KAZUHIRO;OTA SHINYA
分类号 H01L29/22 主分类号 H01L29/22
代理机构 代理人
主权项
地址