发明名称 |
Integration of piezoelectric materials with substrates |
摘要 |
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
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申请公布号 |
US8466606(B2) |
申请公布日期 |
2013.06.18 |
申请号 |
US20100899447 |
申请日期 |
2010.10.06 |
申请人 |
CHEN DAVID M.;KUYPERS JAN H.;GAIDARZHY ALEXEI;ZOLFAGHARKHANI GUITI;GOODELLE JASON;SAND 9, INC. |
发明人 |
CHEN DAVID M.;KUYPERS JAN H.;GAIDARZHY ALEXEI;ZOLFAGHARKHANI GUITI;GOODELLE JASON |
分类号 |
H01L41/053 |
主分类号 |
H01L41/053 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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