| 摘要 |
PURPOSE: A method and an apparatus for forming a through-via and a carrier for the same are provided to reduce costs and time for forming the through-via by skipping a vacuum process in a seed formation process. CONSTITUTION: A via hole passing through a silicon substrate(10) is formed. A conductive carrier(20) is attached on one side of the substrate. A plurality of through holes is formed on the carrier. The via hole is filled by electrodepositing on the substrate. The carrier is separated from the substrate. A conductive film(70) is formed on the carrier. A fixing unit(40) fixes the carrier to a base(30). |
