| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power conversion apparatus having improved cooling properties and assembly workability by integrating a semiconductor module and an electronic component module. <P>SOLUTION: A power conversion apparatus comprises: flat-cube semiconductor modules 2a-2l and flat-cube electronic component modules 3a-3c; and P-terminals 14a, 15a and N-terminals 14b, 15b vertically arranged on flat rectangular lateral faces. When the semiconductor modules 2a-2l and the electronic component modules 3a-3c are laminated with being sandwiched between cooling pipes 5, either or both of the P-terminals 14a, 15a and the N-terminals 14b, 15b in the semiconductor modules 2a-2l and the electronic component modules 3a-3c lie almost in a straight line. <P>COPYRIGHT: (C)2013,JPO&INPIT |
