发明名称 ELECTRONIC COMPONENT UNIT AND HEAT RADIATION METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component unit which adjusts a heat radiation amount at each position in a case considering the flow of a cooling fluid and the position of an electronic component thereby minimizing the imbalance of temperatures in a case body and equalizing the temperatures in the case body. <P>SOLUTION: An electronic component unit 100 includes: a first electronic component group G1; a second electronic component group G2; a case body 110; a first electronic component attachment part 120; and a second electronic component attachment part 130. The first electronic component attachment part 120 and the second electronic component attachment part 130 are provided at positions which are separated from each other in the case body 110. The second electronic component attachment part 130 is provided at the downstream side of the cooling fluid when viewed from the first electronic component attachment part 120, and the second electronic component attachment part 130 contacts with the case body 100 having a contact area larger than the first electronic component attachment part 120. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013120912(A) 申请公布日期 2013.06.17
申请号 JP20110269477 申请日期 2011.12.08
申请人 SHINDENGEN ELECTRIC MFG CO LTD 发明人 NOGUCHI SHOICHI;SHINOHARA KOSUKE
分类号 H05K7/20;H01L23/467 主分类号 H05K7/20
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