| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a soldering device with improved stability when transporting a soldering iron. <P>SOLUTION: A soldering device comprises: a head unit 2 to which a solder iron 20 is mounted; a floating unit 3 for applying a force against its tare weight to the head unit 2 to make it into a floating state; and a transportation unit 4 for transporting the floating unit 3 upward and downward. The floating unit 3 includes: an air cylinder 30 for making the heat unit 2 into the floating state by a pneumatic pressure; and a guide mechanism 31 for guiding elevation of the head unit 2 within a predetermined height range. When the floating unit 3 is transported near a soldering position from an initial position by the transportation unit 4, the air cylinder 30 is controlled so that the head unit 2 is in a locked state at a lower end position, so as to prevent abrasion or breakage of a component, stabilize accuracy and improve reliability. <P>COPYRIGHT: (C)2013,JPO&INPIT |
