| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a Co-Si-based copper alloy sheet which has excellent solder wettability and in which formation of pinholes is less likely to occur in soldering. <P>SOLUTION: The Co-Si-based copper alloy sheet contains 0.5 to 3.0 mass% of Co and 0.1 to 1.8 mass% of Si with the remainder being Cu and unavoidable impurities, and contains >2.0 and ≤4.0 mass% in total of one or more selected from the group consisting of Mn, Fe, Mg, Ni, Cr, V, Nb, Mo, Zr, B, Ag, Be, Zn, Sn, mish metal, and P; and satisfies the following relationship: (surface roughness Ra in the direction parallel to the rolling direction (RD)/surface roughness Ra in the direction orthogonal to the rolling direction (TD))≤0.8. <P>COPYRIGHT: (C)2013,JPO&INPIT |
