MEMBRANE SHEET WITH BUMPS FOR PROBE CARD, PROBE CARD AND METHOD FOR MANUFACTURING MEMBRANE SHEET WITH BUMPS FOR PROBE CARD

摘要

Provided is a probe card for wafer bulk tests. In wafer tests, the probe card stably contacts electrode pads of a wafer at low contact pressure. The probe card comprises the following: a frame plate (1) that has a plurality of through holes (3) corresponding to semiconductor chips of a wafer; a wiring board (23); an anisotropic conductive film (5) that is of a size corresponding to the through holes (3) and that is affixed to the through holes (3) or the periphery of the through holes (3) of the frame plate (1); and a contact film (7) that is of a size corresponding to the through holes (3) and that is affixed to the periphery of the through holes (3) of the frame plate (1). The contact film (7) comprises an insulating film, conductive electrodes (19) that are formed in and on the back surface of the insulating film (15), and bumps (17) formed by plating on the tips of electrode bodies exposed as a result of half-etching of the insulating film (15). The bumps (17) having sharp tips electrically connect to terminals of the wiring board (23) through conductive paths (11) of the anisotropic conductive film (5).