发明名称 Ultrasonic bonding apparatus having Stage fixed Ultrasonic Horn
摘要 PURPOSE: An ultrasonic bonding device equipped with a stage fixed type ultrasonic horn is provided to reduce minute errors on a contact plane by fixedly combining an ultrasonic horn with a fixed lower stage, thereby being capable of obtaining a relatively reliable result. CONSTITUTION: A jig base(10) is provided to be vertically movable. A pressurization member(20) moves vertically according to the movement of a jig base. The pressurization member has a pressurization plane(20a) formed on the lower part to pressurize an object for connection. An elastic member(30) is combined between the jig base and the pressurization member and provides the elastic force between the pressurization member and the jig base. An ultrasonic horn(40) is positioned on a stage(100) arranged with a space from the lower part of the jig base. A fixing jig(60) is combined with the ultrasonic horn and delivers the vibration energy generated by the vibration of the ultrasonic horn to a substrate and a chip.
申请公布号 KR101274559(B1) 申请公布日期 2013.06.13
申请号 KR20110087872 申请日期 2011.08.31
申请人 发明人
分类号 B23K20/10;H05K3/32;H05K13/04 主分类号 B23K20/10
代理机构 代理人
主权项
地址