| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ceramic electronic component which achieves excellent humidity resistance. <P>SOLUTION: A ceramic element assembly where an internal electrode is disposed therein and an end part of the internal electrode is led out on a surface is prepared. An electrode layer, including a first metal filler including a first metal component and a second metal filler including a second metal component having a melting point higher than a melting point of the first metal component, is formed on a surface of the ceramic element assembly so as to cover the end part of the internal electrode. A heating process is conducted to heat the electrode layer and form an electrode having a metal layer which includes the first and second metal components and the metal contained in the internal electrode and is positioned on the surface of the ceramic element assembly. <P>COPYRIGHT: (C)2013,JPO&INPIT |
