PHOTO-CURABLE ORGANIC-INORGANIC HYBRID RESIN COMPOSITION

摘要

The present invention relates to a photo-curable organic-inorganic hybrid protective film resin composition. More particularly, the present invention relates to a photo-curable organic-inorganic hybrid resin composition which has superior physical properties such as UV resistance, chemical resistance, light transmittance, adhesive properties, insulating properties, heat resistance, flatness, and water resistance, and in particular, the superior heat resistance and adhesive properties enable the composition to endure a thermal deformation caused by the variation of a processing temperature during post-processing after a film is cured. Thus, the composition of the present invention is suitable for use as an insulating material, and an encapsulating material, for both a protective film of an optical device having a display device and for a semiconductor.