PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition showing excellent resolution, adhesiveness, and a resist profile of a resist pattern to be formed.

SOLUTION: The photosensitive resin composition includes: a binder polymer having a structural unit derived from (meth)acrylic acid and a structural unit derived from at least one kind of (meth)acrylate selected from the group consisting of (EO)-modified dicyclopentenyl (meth)acrylate, (EO)-modified dicyclopentanyl (meth)acrylate, (EO)-modified isobornyl (meth)acrylate, (EO)-modified adamantyl (meth)acrylate, and (EO)-modified cyclohexyl (meth)acrylate; a photopolymerizable compound; and a photopolymerization initiator.

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