| 发明名称 |
METHOD OF MANUFACTURING BUMP |
| 摘要 |
A bump manufacturing method may be provided. The bump manufacturing method may include forming a bump on an electrode pad included in a semiconductor device, and controlling a shape of the bump by reflowing the bump formed on the semiconductor device under an oxygen atmosphere. |
| 申请公布号 |
US2013149858(A1) |
申请公布日期 |
2013.06.13 |
| 申请号 |
US201213710586 |
申请日期 |
2012.12.11 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD.;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
OK JUNG TAE;KIM HAK HWAN;PAEK HO SUN;KIM KWON JOONG |
| 分类号 |
H01L21/768 |
主分类号 |
H01L21/768 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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