The present invention proposes a through-hole resistance test structure and method. The test structure comprises at least two sub test structures. The sub test structure is one through hole chain. The sub test structure comprises a plurality of through holes and interconnecting wires for connecting all through holes. The through holes make two adjacent upper and lower metal layers communicate with each other. The interconnecting wire is formed of interconnecting wires on the two adjacent metal layers. The interconnecting wires on the two upper and lower layers overlap each other at the connection of the through holes. The sub test structures have the same length. The number of through holes of each sub test structure is different. The total length is the same for the interconnecting wires for connecting the upper layer (lower layer) of all through holes in each sub test structure.
申请公布号
WO2013082834(A1)
申请公布日期
2013.06.13
申请号
WO2011CN84200
申请日期
2011.12.19
申请人
SHANGHAI, RESEARCH INSTITUTE OF MICROELECTRONICS,PEKING UNIVERSITY;WEI, TAI;QIN, XIAOJING;CHENG, YUHUA