| 摘要 |
Embodiments provided herein describe bubbler assemblies for substrate processing systems. The substrate processing bubbler assemblies include an inner shell, an outer shell, and a thermoelectric device. The inner shell is configured to hold a liquid. The outer shell at least partially surrounds the inner shell. The inner shell and the outer shell are sized and shaped such that a gap is formed between the inner shell and the outer shell. The thermoelectric device interconnects the inner shell and the outer shell. The thermoelectric device has a first side adjacent to the inner shell and a second side adjacent to the outer shell and is configured to transfer heat between the first side and the second side thereof.
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