| 摘要 |
A sensor unit (2A) is provided with a metal base member (20A), a solid-state imaging element (30), and an amplifier chip (40). The base member (20A) has a first placement surface (21a) and a second placement surface (21b). The solid-state imaging element (30) has a light-receiving surface (32), and is arranged on the first placement surface (21a) so that the reverse surface (33) and the first placement surface (21a) face each other. The amplifier chip (40) is mounted on a substrate (50) arranged on the second placement surface (21b). The base member (20A) further has a side wall section (25) facing the side surface of the solid-state imaging element (30). The amplifier chip (40) and the solid-state imaging element (30) are electrically connected to each other via a bonding wire (92). The amplifier chip (40) is thermally bonded to the base member (20A) via a thermal via (53) of the substrate (50). |
