发明名称 |
CONDUCTIVE SILVER PASTE FOR A METAL-WRAP-THROUGH SILICON SOLAR CELL |
摘要 |
<p>A conductive silver via paste comprising particulate conductive silver, a lead-tellurium-lithium-titanium-oxide, titanium resinate and an organic vehicle is particularly useful in providing the metallization of the holes in the silicon wafers of MWT solar cells. The result is a metallic electrically conductive via between the collector lines on the front side and the emitter electrode on the back-side of the solar cell. The paste can also be used to form the collector lines on the front-side of the solar cell and the emitter electrode on the back-side of the solar cell. Also disclosed are metal-wrap-through silicon solar cells comprising the fired conductive silver paste.</p> |
申请公布号 |
WO2013085961(A1) |
申请公布日期 |
2013.06.13 |
申请号 |
WO2012US67885 |
申请日期 |
2012.12.05 |
申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
WANG, YUELI;HANG, KENNETH, WARREN |
分类号 |
C03C8/12;C03C8/16;C03C8/18;C03C8/20;H01B1/02 |
主分类号 |
C03C8/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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